| Summary: | A special-purpose computer has a fully enclosed structure. Values of internal temperature often increase for a hermetic case, and the work stability would be weakened. Software Flotherm is used to conduct the analysis of thermal simulations. In this paper, a computational model is established, and the flow process inside the main case is simulated. The temperature distributions of the main case and the motherboard are obtained, and testing experiments are also conducted. Results show that the numerical simulations are almost the same as the experimental results. The simulation model is confirmed accurately, which provides theoretical basis for the design of special-purpose computers. Meanwhile, the cooling structure of the printed circuit board (PCB) is optimized. Compared with the case before the optimization, the optimized cooling structure shows an enhancement of the heat dissipation.
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