Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer

Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer

Capacitive MEMS accelerometers with area-variable periodic-electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding-induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices...

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Bibliographic Details
Main Authors: Dandan Liu, Huafeng Liu, Jinquan Liu, Fangjing Hu, Ji Fan, Wenjie Wu, Liangcheng Tu
Format: Article
Language:English
Published: MDPI AG 2020-02-01
Series:Sensors
Subjects:
mems accelerometer
capacitive transducer
temperature gradient
bonding warpage
Online Access:https://www.mdpi.com/1424-8220/20/4/1186

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https://www.mdpi.com/1424-8220/20/4/1186

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