Mechanical Characterization of Polysilicon MEMS: A Hybrid TMCMC/POD-Kriging Approach

Mechanical Characterization of Polysilicon MEMS: A Hybrid TMCMC/POD-Kriging Approach

Microscale uncertainties related to the geometry and morphology of polycrystalline silicon films, constituting the movable structures of micro electro-mechanical systems (MEMS), were investigated through a joint numerical/experimental approach. An on-chip testing device was designed and fabricated t...

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Bibliographic Details
Main Authors: Ramin Mirzazadeh, Saeed Eftekhar Azam, Stefano Mariani
Format: Article
Language:English
Published: MDPI AG 2018-04-01
Series:Sensors
Subjects:
micro electro-mechanical systems (MEMS)
uncertainty quantification
transitional Markov chain Monte Carlo (TMCMC) analysis
reduced-order modeling
polysilicon morphology
overetch
Online Access:http://www.mdpi.com/1424-8220/18/4/1243

Internet

http://www.mdpi.com/1424-8220/18/4/1243

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