Thermal Impact on the Power Device Behaviour: Application on the IGBT

Thermal Impact on the Power Device Behaviour: Application on the IGBT

The functional limits of an IGBT are defined by an essential parameter: the maximum junction temperature permitted. The technical specifications of each IGBT type provide the limit values of the functional temperature for example, from -55 C to 150 C. The electrical energy dissipated by the IGBT for...

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Bibliographic Details
Main Authors: HALLOUCHE, A., TILMATNE, A.
Format: Article
Language:English
Published: Stefan cel Mare University of Suceava 2007-04-01
Series:Advances in Electrical and Computer Engineering
Subjects:
punch-trough IGBT
high frequency
temperature of junction
tailing current
Online Access:http://dx.doi.org/10.4316/AECE.2007.01002
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spelling doaj-59bebfdc3de8481fbf1ba5b6d3963b602020-11-25T00:40:58ZengStefan cel Mare University of SuceavaAdvances in Electrical and Computer Engineering1582-74451844-76002007-04-0171912Thermal Impact on the Power Device Behaviour: Application on the IGBTHALLOUCHE, A.TILMATNE, A.The functional limits of an IGBT are defined by an essential parameter: the maximum junction temperature permitted. The technical specifications of each IGBT type provide the limit values of the functional temperature for example, from -55 C to 150 C. The electrical energy dissipated by the IGBT for any current direction, appears in form of thermal energy at the junctions level. But we should bear in mind that the ambient temperature represents an energetic level through which is insured the raise of the junction temperature.http://dx.doi.org/10.4316/AECE.2007.01002punch-trough IGBThigh frequencytemperature of junctiontailing current
collection DOAJ
language English
format Article
sources DOAJ
author HALLOUCHE, A.
TILMATNE, A.
spellingShingle HALLOUCHE, A.
TILMATNE, A.
Thermal Impact on the Power Device Behaviour: Application on the IGBT
Advances in Electrical and Computer Engineering
punch-trough IGBT
high frequency
temperature of junction
tailing current
author_facet HALLOUCHE, A.
TILMATNE, A.
author_sort HALLOUCHE, A.
title Thermal Impact on the Power Device Behaviour: Application on the IGBT
title_short Thermal Impact on the Power Device Behaviour: Application on the IGBT
title_full Thermal Impact on the Power Device Behaviour: Application on the IGBT
title_fullStr Thermal Impact on the Power Device Behaviour: Application on the IGBT
title_full_unstemmed Thermal Impact on the Power Device Behaviour: Application on the IGBT
title_sort thermal impact on the power device behaviour: application on the igbt
publisher Stefan cel Mare University of Suceava
series Advances in Electrical and Computer Engineering
issn 1582-7445
1844-7600
publishDate 2007-04-01
description The functional limits of an IGBT are defined by an essential parameter: the maximum junction temperature permitted. The technical specifications of each IGBT type provide the limit values of the functional temperature for example, from -55 C to 150 C. The electrical energy dissipated by the IGBT for any current direction, appears in form of thermal energy at the junctions level. But we should bear in mind that the ambient temperature represents an energetic level through which is insured the raise of the junction temperature.
topic punch-trough IGBT
high frequency
temperature of junction
tailing current
url http://dx.doi.org/10.4316/AECE.2007.01002
work_keys_str_mv AT hallouchea thermalimpactonthepowerdevicebehaviourapplicationontheigbt
AT tilmatnea thermalimpactonthepowerdevicebehaviourapplicationontheigbt
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