Mathematical and Simulation Modelling of Moisture Diffusion Mechanism during Plastic IC Packages Disassembly
Reuse of plastic IC packages disassembled from printed circuit boards (PCBs) has significant environmental benefits and economic value. The interface delamination caused by moisture diffusion is the main failure mode of IC packages during the disassembling process, which greatly reduces the reusabil...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2013-01-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1155/2013/928671 |