Microstructural Study on Molten Marks of Fire-Causing Copper Wires

Microstructural Study on Molten Marks of Fire-Causing Copper Wires

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Although electrical fires constitute the greatest percentage of the main causes of building fires, the critical evidence used by fire investigators to identify electrical fires is not always convincing to the general public. In this study, we scrutinized the microstructures of fire-causing copper wi...

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Bibliographic Details
Main Authors: Kuan-Heng Liu, Yung-Hui Shih, Guo-Ju Chen, Jaw-Min Chou
Format: Article
Language:English
Published: MDPI AG 2015-06-01
Series:Materials
Subjects:
copper
dendrite growth
solidification microstructure
transmission electron microscopy
fire
fire investigation
fire scene
electrical short circuit
electrical arc beads
Online Access:http://www.mdpi.com/1996-1944/8/6/3776

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http://www.mdpi.com/1996-1944/8/6/3776

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