Analysis Of The Underpotential Deposition Of Cadmium On Copper

Analysis Of The Underpotential Deposition Of Cadmium On Copper

In this study the process of deposition of cadmium on polycrystalline copper electrode in sulfate solution was investigated. The process of underpotential and bulk deposition was analyzed by classical electrochemical method: cyclic voltammetry(CV), anodic stripping voltammetry(ASV) and electrochemic...

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Main Author: Kowalik R.
Format: Article
Language:English
Published: Polish Academy of Sciences 2015-09-01
Series:Archives of Metallurgy and Materials
Online Access:http://www.degruyter.com/view/j/amm.2015.60.issue-3/amm-2015-0284/amm-2015-0284.xml?format=INT
id doaj-52d10f4ebd984ade8be7bf4b8a46d3e1
record_format Article
spelling doaj-52d10f4ebd984ade8be7bf4b8a46d3e12020-11-25T03:39:24ZengPolish Academy of SciencesArchives of Metallurgy and Materials2300-19092015-09-016031629163210.1515/amm-2015-0284amm-2015-0284Analysis Of The Underpotential Deposition Of Cadmium On CopperKowalik R.0 AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY, FACULTY OF NON-FERROUS METALS, DEPARTMENT OF PHYSICAL CHEMISTRY AND METALLURGY OF NON-FERROUS METALS, AL. A. MICKIEWICZA 30, 30-059 KRAKÓW, POLANDIn this study the process of deposition of cadmium on polycrystalline copper electrode in sulfate solution was investigated. The process of underpotential and bulk deposition was analyzed by classical electrochemical method: cyclic voltammetry(CV), anodic stripping voltammetry(ASV) and electrochemical quartz crystal microbalance(EQCM). The obtained results were compared with electrochemical impedance spectroscopy(EIS) measurements. CV, EQCM and EIS results suggest that the UPD of cadmium starts below potential −0.4 V vs Ag/AgCl. Additionally the stripping analysis indicates the formation of cadmium monolayer with different density of deposited atoms depending on the applied potential. The transition from UPD to bulk deposition occurs below potential −0,7 V.http://www.degruyter.com/view/j/amm.2015.60.issue-3/amm-2015-0284/amm-2015-0284.xml?format=INT
collection DOAJ
language English
format Article
sources DOAJ
author Kowalik R.
spellingShingle Kowalik R.
Analysis Of The Underpotential Deposition Of Cadmium On Copper
Archives of Metallurgy and Materials
author_facet Kowalik R.
author_sort Kowalik R.
title Analysis Of The Underpotential Deposition Of Cadmium On Copper
title_short Analysis Of The Underpotential Deposition Of Cadmium On Copper
title_full Analysis Of The Underpotential Deposition Of Cadmium On Copper
title_fullStr Analysis Of The Underpotential Deposition Of Cadmium On Copper
title_full_unstemmed Analysis Of The Underpotential Deposition Of Cadmium On Copper
title_sort analysis of the underpotential deposition of cadmium on copper
publisher Polish Academy of Sciences
series Archives of Metallurgy and Materials
issn 2300-1909
publishDate 2015-09-01
description In this study the process of deposition of cadmium on polycrystalline copper electrode in sulfate solution was investigated. The process of underpotential and bulk deposition was analyzed by classical electrochemical method: cyclic voltammetry(CV), anodic stripping voltammetry(ASV) and electrochemical quartz crystal microbalance(EQCM). The obtained results were compared with electrochemical impedance spectroscopy(EIS) measurements. CV, EQCM and EIS results suggest that the UPD of cadmium starts below potential −0.4 V vs Ag/AgCl. Additionally the stripping analysis indicates the formation of cadmium monolayer with different density of deposited atoms depending on the applied potential. The transition from UPD to bulk deposition occurs below potential −0,7 V.
url http://www.degruyter.com/view/j/amm.2015.60.issue-3/amm-2015-0284/amm-2015-0284.xml?format=INT
work_keys_str_mv AT kowalikr analysisoftheunderpotentialdepositionofcadmiumoncopper
_version_ 1724539085622607872

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