Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods
Glass is a well-known non‑conductive material that has many useful properties, and considerable research has been conducted into making circuits on glass. Many deposition techniques have been studied, and laser-induced chemical liquid phase deposition (LCLD) is a well‑known and cost-effective method...
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2020-07-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/13/13/2977 |
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doaj-529830b0f7d14a888c36674bdafa3bba2020-11-25T03:22:17ZengMDPI AGMaterials1996-19442020-07-01132977297710.3390/ma13132977Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition MethodsJae Min Seo0Kui-Kam Kwon1Ki Young Song2Chong Nam Chu3Sung-Hoon Ahn4Department of Mechanical & Aerospace Engineering, Seoul National University, 1, Kwanak‑ro, Kwanak‑gu, Seoul 08826, KoreaDepartment of Mechanical & Aerospace Engineering, Seoul National University, 1, Kwanak‑ro, Kwanak‑gu, Seoul 08826, KoreaSchool of Mechanical Engineering, Soongsil University, 369, Sangdo‑ro, Dongjak‑gu, Seoul 06978, KoreaDepartment of Mechanical & Aerospace Engineering, Seoul National University, 1, Kwanak‑ro, Kwanak‑gu, Seoul 08826, KoreaDepartment of Mechanical & Aerospace Engineering, Seoul National University, 1, Kwanak‑ro, Kwanak‑gu, Seoul 08826, KoreaGlass is a well-known non‑conductive material that has many useful properties, and considerable research has been conducted into making circuits on glass. Many deposition techniques have been studied, and laser-induced chemical liquid phase deposition (LCLD) is a well‑known and cost-effective method for rapid prototyping of copper deposition on glass. However, the deposition results from the LCLD method on the surface of glass, which shows an issue in its detachment from the substrates because of the relatively low adhesion between deposited copper and the nontreated glass surface. This problem undermines the usability of deposited glass in industrial applications. In this study, the laser‑induced backside wet etching (LIBWE) method was performed as a preceding process to fabricate microchannels, which were filled with copper by LCLD. Additional durable copper wire was produced as a result of the enhanced adhesion between the glass and the deposited copper. The adhesion was enhanced by a rough surface and metal layer, which are characteristics of LIBWE machining. Furthermore, the proposed method is expected to broaden the use of deposited glass in industrial applications, such as in stacked or covered multilayer structures with built-in copper wires, because the inserted copper can be physically protected by the microstructures.https://www.mdpi.com/1996-1944/13/13/2977laser induced chemical liquid phase depositionlaser‑induced backside wet etchingadditive machiningembedded metallic patterns on glassanchor effect |
| collection |
DOAJ |
| language |
English |
| format |
Article |
| sources |
DOAJ |
| author |
Jae Min Seo Kui-Kam Kwon Ki Young Song Chong Nam Chu Sung-Hoon Ahn |
| spellingShingle |
Jae Min Seo Kui-Kam Kwon Ki Young Song Chong Nam Chu Sung-Hoon Ahn Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods Materials laser induced chemical liquid phase deposition laser‑induced backside wet etching additive machining embedded metallic patterns on glass anchor effect |
| author_facet |
Jae Min Seo Kui-Kam Kwon Ki Young Song Chong Nam Chu Sung-Hoon Ahn |
| author_sort |
Jae Min Seo |
| title |
Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods |
| title_short |
Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods |
| title_full |
Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods |
| title_fullStr |
Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods |
| title_full_unstemmed |
Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods |
| title_sort |
deposition of durable micro copper patterns into glass by combining laser-induced backside wet etching and laser-induced chemical liquid phase deposition methods |
| publisher |
MDPI AG |
| series |
Materials |
| issn |
1996-1944 |
| publishDate |
2020-07-01 |
| description |
Glass is a well-known non‑conductive material that has many useful properties, and considerable research has been conducted into making circuits on glass. Many deposition techniques have been studied, and laser-induced chemical liquid phase deposition (LCLD) is a well‑known and cost-effective method for rapid prototyping of copper deposition on glass. However, the deposition results from the LCLD method on the surface of glass, which shows an issue in its detachment from the substrates because of the relatively low adhesion between deposited copper and the nontreated glass surface. This problem undermines the usability of deposited glass in industrial applications. In this study, the laser‑induced backside wet etching (LIBWE) method was performed as a preceding process to fabricate microchannels, which were filled with copper by LCLD. Additional durable copper wire was produced as a result of the enhanced adhesion between the glass and the deposited copper. The adhesion was enhanced by a rough surface and metal layer, which are characteristics of LIBWE machining. Furthermore, the proposed method is expected to broaden the use of deposited glass in industrial applications, such as in stacked or covered multilayer structures with built-in copper wires, because the inserted copper can be physically protected by the microstructures. |
| topic |
laser induced chemical liquid phase deposition laser‑induced backside wet etching additive machining embedded metallic patterns on glass anchor effect |
| url |
https://www.mdpi.com/1996-1944/13/13/2977 |
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