Processing Techniques for Bioresorbable Nanoparticles in Fabricating Flexible Conductive Interconnects

• Main Authors: Jiameng Li, Shiyu Luo, Jiaxuan Liu, Hang Xu, Xian Huang
• Format: Article
• Language: English
• Published: MDPI AG 2018-06-01
• Series: Materials
• Subjects: bioresorbable electronics; printing electronics techniques; conductive inks
• Online Access: http://www.mdpi.com/1996-1944/11/7/1102

Bioresorbable electronics (or transient electronics) devices can be potentially used to replace build-to-last devices in consumer electronics, implantable devices, and data security, leading to reduced electronic waste and surgical processes through controllable dissolution. Recent development of printing bioresorbable electronics leads to bioresorbable conductive pastes or inks that can be used to make interconnects, circuit traces, and sensors, offering alternative solutions for the predominant complementary metal oxide semiconductor (CMOS) processes in fabrication of bioresorbable electronics. However, the conductivities offered by current bioresorbable pastes and processing techniques are still much lower than those of the bulk metals, demanding further improvement in both paste composition and process optimization. This paper aims at exploring several influential factors such as paste compositions and processing techniques in determining conductivities of bioresorbable patterns. Experimental results reveal that an optimized paste constituent with a ratio of Zn:PVP:glycerol:methanol = 7:0.007:2:1 by weight can generate stable conductive pastes suitable for a screen printing process. In addition, a high conductivity of 60,213.6 S/m can be obtained by combining hot rolling and photonic sintering. The results demonstrate that large-scale transient electronics can be obtained by combining screen printing, hot rolling and photonic sintering approaches with optimized paste compositions, offering important experimental proofs and approaches for further improving the conductivity of bioresorbable pastes or inks that can accommodate the demands for mass fabrication and practical use in electronic industry.