Influence of measurement conditions and used devices on consequential creep modulus

Influence of measurement conditions and used devices on consequential creep modulus

This research deals with study of the possibilities of the creep properties measurement on dedicated devices for the creep measurement and on devices, which enable the creep properties measurement. A comparison of these two different measurement methods show the influence of boundary conditions on t...

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Main Authors: Reznicek Martin, Bednarik Martin, Hylova Lenka, Manas David
Format: Article
Language:English
Published: EDP Sciences 2016-01-01
Series:MATEC Web of Conferences
Online Access:http://dx.doi.org/10.1051/matecconf/20167602025
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spelling doaj-52113441216546019a2677787940974d2021-02-02T01:39:46ZengEDP SciencesMATEC Web of Conferences2261-236X2016-01-01760202510.1051/matecconf/20167602025matecconf_cscc2016_02025Influence of measurement conditions and used devices on consequential creep modulusReznicek Martin0Bednarik Martin1Hylova Lenka2Manas David3Tomas Bata University in ZlinTomas Bata University in ZlinTomas Bata University in ZlinTomas Bata University in ZlinThis research deals with study of the possibilities of the creep properties measurement on dedicated devices for the creep measurement and on devices, which enable the creep properties measurement. A comparison of these two different measurement methods show the influence of boundary conditions on the measurement result. Simultaneously, the effort to shorten the long-term tests, because of time saving during research and development of new materials, is confronted here. Radiation crosslinking samples of high-density polyethylene (HDPE), which enable the change of the internal structure to the spatial network by the influence of beta radiation, were chosen as an example for comparison.http://dx.doi.org/10.1051/matecconf/20167602025
collection DOAJ
language English
format Article
sources DOAJ
author Reznicek Martin
Bednarik Martin
Hylova Lenka
Manas David
spellingShingle Reznicek Martin
Bednarik Martin
Hylova Lenka
Manas David
Influence of measurement conditions and used devices on consequential creep modulus
MATEC Web of Conferences
author_facet Reznicek Martin
Bednarik Martin
Hylova Lenka
Manas David
author_sort Reznicek Martin
title Influence of measurement conditions and used devices on consequential creep modulus
title_short Influence of measurement conditions and used devices on consequential creep modulus
title_full Influence of measurement conditions and used devices on consequential creep modulus
title_fullStr Influence of measurement conditions and used devices on consequential creep modulus
title_full_unstemmed Influence of measurement conditions and used devices on consequential creep modulus
title_sort influence of measurement conditions and used devices on consequential creep modulus
publisher EDP Sciences
series MATEC Web of Conferences
issn 2261-236X
publishDate 2016-01-01
description This research deals with study of the possibilities of the creep properties measurement on dedicated devices for the creep measurement and on devices, which enable the creep properties measurement. A comparison of these two different measurement methods show the influence of boundary conditions on the measurement result. Simultaneously, the effort to shorten the long-term tests, because of time saving during research and development of new materials, is confronted here. Radiation crosslinking samples of high-density polyethylene (HDPE), which enable the change of the internal structure to the spatial network by the influence of beta radiation, were chosen as an example for comparison.
url http://dx.doi.org/10.1051/matecconf/20167602025
work_keys_str_mv AT reznicekmartin influenceofmeasurementconditionsanduseddevicesonconsequentialcreepmodulus
AT bednarikmartin influenceofmeasurementconditionsanduseddevicesonconsequentialcreepmodulus
AT hylovalenka influenceofmeasurementconditionsanduseddevicesonconsequentialcreepmodulus
AT manasdavid influenceofmeasurementconditionsanduseddevicesonconsequentialcreepmodulus
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