Direct Defect-Level Analysis of Metal–Insulator–Metal Capacitor Using Internal Photoemission Spectroscopy

Barrier height (<inline-formula> <tex-math notation="LaTeX">$\phi _{b}$ </tex-math></inline-formula>), trap state, bandgap (<inline-formula> <tex-math notation="LaTeX">$E_{g}$ </tex-math></inline-formula>), and band alignment inform...

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Bibliographic Details
Main Authors: Tae Jin Yoo, Hyeon Jun Hwang, Soo Cheol Kang, Sunwoo Heo, Ho-In Lee, Young Gon Lee, Hokyung Park, Byoung Hun Lee
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9404305/
Description
Summary:Barrier height (<inline-formula> <tex-math notation="LaTeX">$\phi _{b}$ </tex-math></inline-formula>), trap state, bandgap (<inline-formula> <tex-math notation="LaTeX">$E_{g}$ </tex-math></inline-formula>), and band alignment information of the metal&#x2013;ZrO<sub>2</sub>&#x2013;metal capacitor have been extracted using internal photoemission (IPE) system. By correlating the IPE analysis with I-V and C-V characteristics obtained before and after rapid thermal annealing, origin and transformation of defect states have been successfully investigated. Our analysis revealed that deep-level defects originating from oxygen vacancies near the top electrode are causing of leakage current in MIM capacitor and these defects can be effectively reduced by a proper thermal annealing.
ISSN:2168-6734