Improvement of Thin Film Adhesion Due to Bombardment by Fast Argon Atoms
A new hollow cathode sputtering system is used for beam-assisted deposition of thin films on dielectric substrates. A copper target placed at the hollow cathode bottom is uniformly sputtered by argon ions from the glow discharge plasma filling the cathode. Through an emissive grid, sputtered copper...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-08-01
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| Series: | Coatings |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2079-6412/8/9/303 |