A Microwave Platform for Reliable and Instant Interconnecting Combined with Microwave-Microfluidic Interdigital Capacitor Chips for Sensing Applications
This work presents a novel platform conceived as an interconnect box (ICB) that brings high-frequency signals from microwave instruments to consumable lab-on-a-chip devices. The ICB can be connected to instruments with a standard coaxial connector and to consumable chips by introducing a spring-leve...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-03-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/20/6/1687 |