Encapsulation of power electronics components for operation in harsh environments
This paper reports on analyses and testing of sensitive power electronics components encapsulation concept, enabling operation in harsh, especially high pressure environments. The paper describes development of the concept of epoxy modules that can be used for protecting of the power electronics com...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2017-12-01
|
| Series: | Archives of Electrical Engineering |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/aee.2017.66.issue-4/aee-2017-0065/aee-2017-0065.xml?format=INT |