BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits

BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits

A new sensor topology meant to extract figures of merit of radio-frequency analog integrated circuits (RF-ICs) was experimentally validated. Implemented in a standard 0.35 μm complementary metal-oxide-semiconductor (CMOS) technology, it comprised two blocks: a single metal-oxide-semiconductor (MOS)...

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Bibliographic Details
Main Authors: Josep Altet, Enrique Barajas, Diego Mateo, Alexandre Billong, Xavier Aragones, Xavier Perpiñà, Ferran Reverter
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Sensors
Subjects:
CMOS thermal sensor
CMOS built-in sensor
CMOS integrated circuits
measurement of RF CMOS circuits
built-in test and measurement
Online Access:https://www.mdpi.com/1424-8220/21/3/805

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