Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application

<p>Abstract</p> <p>Nanostructuring of ultrathin HfO<sub>2 </sub>films deposited on GaAs (001) substrates by high-resolution Lloyd's mirror laser interference nanolithography is described. Pattern transfer to the HfO<sub>2 </sub>film was carried out by r...

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Main Authors: Molina-Aldareguia Jon, Monaghan Scott, Hurley Paul, Cherkaoui Karim, Benedicto Marcos, Galiana Beatriz, Vazquez Luis, Tejedor Paloma
Format: Article
Language:English
Published: SpringerOpen 2011-01-01
Series:Nanoscale Research Letters
Online Access:http://www.nanoscalereslett.com/content/6/1/400
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spelling doaj-45478afec9db4d73aae2bb9e7bc787ba2020-11-24T21:04:43ZengSpringerOpenNanoscale Research Letters1931-75731556-276X2011-01-0161400Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS applicationMolina-Aldareguia JonMonaghan ScottHurley PaulCherkaoui KarimBenedicto MarcosGaliana BeatrizVazquez LuisTejedor Paloma<p>Abstract</p> <p>Nanostructuring of ultrathin HfO<sub>2 </sub>films deposited on GaAs (001) substrates by high-resolution Lloyd's mirror laser interference nanolithography is described. Pattern transfer to the HfO<sub>2 </sub>film was carried out by reactive ion beam etching using CF<sub>4 </sub>and O<sub>2 </sub>plasmas. A combination of atomic force microscopy, high-resolution scanning electron microscopy, high-resolution transmission electron microscopy, and energy-dispersive X-ray spectroscopy microanalysis was used to characterise the various etching steps of the process and the resulting HfO<sub>2</sub>/GaAs pattern morphology, structure, and chemical composition. We show that the patterning process can be applied to fabricate uniform arrays of HfO<sub>2 </sub>mesa stripes with tapered sidewalls and linewidths of 100 nm. The exposed GaAs trenches were found to be residue-free and atomically smooth with a root-mean-square line roughness of 0.18 nm after plasma etching.</p> <p>PACS: Dielectric oxides 77.84.Bw, Nanoscale pattern formation 81.16.Rf, Plasma etching 52.77.Bn, Fabrication of III-V semiconductors 81.05.Ea</p> http://www.nanoscalereslett.com/content/6/1/400
collection DOAJ
language English
format Article
sources DOAJ
author Molina-Aldareguia Jon
Monaghan Scott
Hurley Paul
Cherkaoui Karim
Benedicto Marcos
Galiana Beatriz
Vazquez Luis
Tejedor Paloma
spellingShingle Molina-Aldareguia Jon
Monaghan Scott
Hurley Paul
Cherkaoui Karim
Benedicto Marcos
Galiana Beatriz
Vazquez Luis
Tejedor Paloma
Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application
Nanoscale Research Letters
author_facet Molina-Aldareguia Jon
Monaghan Scott
Hurley Paul
Cherkaoui Karim
Benedicto Marcos
Galiana Beatriz
Vazquez Luis
Tejedor Paloma
author_sort Molina-Aldareguia Jon
title Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application
title_short Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application
title_full Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application
title_fullStr Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application
title_full_unstemmed Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application
title_sort fabrication of hfo<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for iii-v cmos application
publisher SpringerOpen
series Nanoscale Research Letters
issn 1931-7573
1556-276X
publishDate 2011-01-01
description <p>Abstract</p> <p>Nanostructuring of ultrathin HfO<sub>2 </sub>films deposited on GaAs (001) substrates by high-resolution Lloyd's mirror laser interference nanolithography is described. Pattern transfer to the HfO<sub>2 </sub>film was carried out by reactive ion beam etching using CF<sub>4 </sub>and O<sub>2 </sub>plasmas. A combination of atomic force microscopy, high-resolution scanning electron microscopy, high-resolution transmission electron microscopy, and energy-dispersive X-ray spectroscopy microanalysis was used to characterise the various etching steps of the process and the resulting HfO<sub>2</sub>/GaAs pattern morphology, structure, and chemical composition. We show that the patterning process can be applied to fabricate uniform arrays of HfO<sub>2 </sub>mesa stripes with tapered sidewalls and linewidths of 100 nm. The exposed GaAs trenches were found to be residue-free and atomically smooth with a root-mean-square line roughness of 0.18 nm after plasma etching.</p> <p>PACS: Dielectric oxides 77.84.Bw, Nanoscale pattern formation 81.16.Rf, Plasma etching 52.77.Bn, Fabrication of III-V semiconductors 81.05.Ea</p>
url http://www.nanoscalereslett.com/content/6/1/400
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