Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application
<p>Abstract</p> <p>Nanostructuring of ultrathin HfO<sub>2 </sub>films deposited on GaAs (001) substrates by high-resolution Lloyd's mirror laser interference nanolithography is described. Pattern transfer to the HfO<sub>2 </sub>film was carried out by r...
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2011-01-01
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Series: | Nanoscale Research Letters |
Online Access: | http://www.nanoscalereslett.com/content/6/1/400 |
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doaj-45478afec9db4d73aae2bb9e7bc787ba2020-11-24T21:04:43ZengSpringerOpenNanoscale Research Letters1931-75731556-276X2011-01-0161400Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS applicationMolina-Aldareguia JonMonaghan ScottHurley PaulCherkaoui KarimBenedicto MarcosGaliana BeatrizVazquez LuisTejedor Paloma<p>Abstract</p> <p>Nanostructuring of ultrathin HfO<sub>2 </sub>films deposited on GaAs (001) substrates by high-resolution Lloyd's mirror laser interference nanolithography is described. Pattern transfer to the HfO<sub>2 </sub>film was carried out by reactive ion beam etching using CF<sub>4 </sub>and O<sub>2 </sub>plasmas. A combination of atomic force microscopy, high-resolution scanning electron microscopy, high-resolution transmission electron microscopy, and energy-dispersive X-ray spectroscopy microanalysis was used to characterise the various etching steps of the process and the resulting HfO<sub>2</sub>/GaAs pattern morphology, structure, and chemical composition. We show that the patterning process can be applied to fabricate uniform arrays of HfO<sub>2 </sub>mesa stripes with tapered sidewalls and linewidths of 100 nm. The exposed GaAs trenches were found to be residue-free and atomically smooth with a root-mean-square line roughness of 0.18 nm after plasma etching.</p> <p>PACS: Dielectric oxides 77.84.Bw, Nanoscale pattern formation 81.16.Rf, Plasma etching 52.77.Bn, Fabrication of III-V semiconductors 81.05.Ea</p> http://www.nanoscalereslett.com/content/6/1/400 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Molina-Aldareguia Jon Monaghan Scott Hurley Paul Cherkaoui Karim Benedicto Marcos Galiana Beatriz Vazquez Luis Tejedor Paloma |
spellingShingle |
Molina-Aldareguia Jon Monaghan Scott Hurley Paul Cherkaoui Karim Benedicto Marcos Galiana Beatriz Vazquez Luis Tejedor Paloma Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application Nanoscale Research Letters |
author_facet |
Molina-Aldareguia Jon Monaghan Scott Hurley Paul Cherkaoui Karim Benedicto Marcos Galiana Beatriz Vazquez Luis Tejedor Paloma |
author_sort |
Molina-Aldareguia Jon |
title |
Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application |
title_short |
Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application |
title_full |
Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application |
title_fullStr |
Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application |
title_full_unstemmed |
Fabrication of HfO<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for III-V CMOS application |
title_sort |
fabrication of hfo<sub>2 </sub>patterns by laser interference nanolithography and selective dry etching for iii-v cmos application |
publisher |
SpringerOpen |
series |
Nanoscale Research Letters |
issn |
1931-7573 1556-276X |
publishDate |
2011-01-01 |
description |
<p>Abstract</p> <p>Nanostructuring of ultrathin HfO<sub>2 </sub>films deposited on GaAs (001) substrates by high-resolution Lloyd's mirror laser interference nanolithography is described. Pattern transfer to the HfO<sub>2 </sub>film was carried out by reactive ion beam etching using CF<sub>4 </sub>and O<sub>2 </sub>plasmas. A combination of atomic force microscopy, high-resolution scanning electron microscopy, high-resolution transmission electron microscopy, and energy-dispersive X-ray spectroscopy microanalysis was used to characterise the various etching steps of the process and the resulting HfO<sub>2</sub>/GaAs pattern morphology, structure, and chemical composition. We show that the patterning process can be applied to fabricate uniform arrays of HfO<sub>2 </sub>mesa stripes with tapered sidewalls and linewidths of 100 nm. The exposed GaAs trenches were found to be residue-free and atomically smooth with a root-mean-square line roughness of 0.18 nm after plasma etching.</p> <p>PACS: Dielectric oxides 77.84.Bw, Nanoscale pattern formation 81.16.Rf, Plasma etching 52.77.Bn, Fabrication of III-V semiconductors 81.05.Ea</p> |
url |
http://www.nanoscalereslett.com/content/6/1/400 |
work_keys_str_mv |
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