Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound

• Main Authors: Wen-Lin Wu, Xing-Guo Wang, Zhi-Cheng Huang, Nan-Xing Wu
• Format: Article
• Language: English
• Published: AIP Publishing LLC 2017-12-01
• Series: AIP Advances
• Online Access: http://dx.doi.org/10.1063/1.5001248

An air-coupled ultrasonic method, focusing on the problem that weak bonding interface is difficult to accurately measure using conventional nondestructive testing technique, is proposed to evaluate the bond integrity. Based on the spring model and the potential function theory, a theoretical model is established to predict the through-transmission spectrum in double-layer adhesive structure. The result of a theoretical algorithm shows that all the resonant transmission peaks move towards higher frequency with the increase of the interfacial stiffness. The reason for these movements is related to either the normal stiffness (KN) or the transverse stiffness (KT). A method to optimize the measurement parameters (i.e. the incident angle and testing frequency) is put forward through analyzing the relationship between the resonant transmission peaks and the interfacial spring stiffness at the frequency below 1MHz. The air-coupled ultrasonic testing experiments at the normal and oblique incident angle respectively are carried out to verify the theoretical analysis and to accurately measure the interfacial stiffness of double-layer adhesive composite plate. The experimental results are good agreement with the results from the theoretical algorithm, and the relationship between bonding time and interfacial stiffness is presented at the end of this paper.