Photocatalytic Surface Modification of PI Film for Electroless Copper Plating

Photocatalytic Surface Modification of PI Film for Electroless Copper Plating

This study investigated the surface modification of polyimide (PI) film through TiO2 photocatalytic treatment. The effects of TiO2 content, treatment duration, and UV power on the surface topography, surface contact angle, and adhesion strength of the surface-modified PI films were investigated. The...

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Bibliographic Details
Main Authors: Wenxia Zhao, Zenglin Wang, Liang Qiao, Shiwei Liu, Hongjian Zhao, Yani Yan
Format: Article
Language:English
Published: Hindawi Limited 2018-01-01
Series:Advances in Condensed Matter Physics
Online Access:http://dx.doi.org/10.1155/2018/1619581

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