An Experimental Study on the Precision Abrasive Machining Process of Hard and Brittle Materials with Ultraviolet-Resin Bond Diamond Abrasive Tools

• Main Authors: Lei Guo, Xinrong Zhang, Shibin Chen, Jizhuang Hui
• Format: Article
• Language: English
• Published: MDPI AG 2019-01-01
• Series: Materials
• Subjects: abrasive machining; sapphire substrate; resin bond
• Online Access: http://www.mdpi.com/1996-1944/12/1/125

Ultraviolet-curable resin was introduced as a bonding agent into the fabrication process of precision abrasive machining tools in this study, aiming to deliver a rapid, flexible, economical, and environment-friendly additive manufacturing process to replace the hot press and sintering process with thermal-curable resin. A laboratory manufacturing process was established to develop an ultraviolet-curable resin bond diamond lapping plate, the machining performance of which on the ceramic workpiece was examined through a series of comparative experiments with slurry-based iron plate lapping. The machined surface roughness and weight loss of the workpieces were periodically recorded to evaluate the surface finish quality and the material removal rate. The promising results in terms of a 12% improvement in surface roughness and 25% reduction in material removal rate were obtained from the ultraviolet-curable resin plate-involved lapping process. A summarized hypothesis was drawn to describe the dynamically-balanced state of the hybrid precision abrasive machining process integrated both the two-body and three-body abrasion mode.