Study on Dissolution of Al<sub>2</sub>Cu in Al-4.3Cu and A205 Cast Alloys

Evolution of microstructure in a binary Al-Cu system (Al-4.3Cu) and a commercially alloyed Al-Cu system (A205) during solution heat treatment was investigated using optical microscopy (OM), scanning electron microscopy (SEM), wavelength-dispersive X-ray spectroscopy (WDS), and differential scanning...

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Main Authors: Mohammadreza Zamani, Ilia Belov, Emma Sjölander, Anton Bjurenstedt, Ehsan Ghassemali, Salem Seifeddine
Format: Article
Language:English
Published: MDPI AG 2020-07-01
Series:Metals
Subjects:
Online Access:https://www.mdpi.com/2075-4701/10/7/900
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spelling doaj-43064cac944f4752b79740798f6c04e82020-11-25T03:37:32ZengMDPI AGMetals2075-47012020-07-011090090010.3390/met10070900Study on Dissolution of Al<sub>2</sub>Cu in Al-4.3Cu and A205 Cast AlloysMohammadreza Zamani0Ilia Belov1Emma Sjölander2Anton Bjurenstedt3Ehsan Ghassemali4Salem Seifeddine5Department of Materials and Manufacturing, School of Engineering, Jönköping University, 551 11 Jönköping, SwedenDepartment of Materials and Manufacturing, School of Engineering, Jönköping University, 551 11 Jönköping, SwedenScania CV AB, 15187 Södertälje, SwedenRISE SWECAST, 550 02 Jönköping, SwedenDepartment of Materials and Manufacturing, School of Engineering, Jönköping University, 551 11 Jönköping, SwedenDepartment of Materials and Manufacturing, School of Engineering, Jönköping University, 551 11 Jönköping, SwedenEvolution of microstructure in a binary Al-Cu system (Al-4.3Cu) and a commercially alloyed Al-Cu system (A205) during solution heat treatment was investigated using optical microscopy (OM), scanning electron microscopy (SEM), wavelength-dispersive X-ray spectroscopy (WDS), and differential scanning calorimetry (DSC). The diversified coarseness of the microstructure was initiated by controlling the solidification rate. Different solution treatment temperatures were applied to identify a proper solutioning temperature. The larger microstructural scale required an increased solutioning temperature and prolonged holding time to obtain homogenized solutes in the α-Al matrix. The diffusion of Cu primarily controlled the solution heat treatment process. A diffusion-based model was applied and calibrated to determine the dissolution rate of an Al<sub>2</sub>Cu particle in the matrix. The model operates on a similar time scale with the experimental results for the Al-4.3Cu and A205 alloys with various microstructural scales, different chemical compositions, and at different solution treatment temperatures. Three-dimensional (3D) reconstructed images from SEM images and energy dispersive spectroscopy (EDS) map of elements showed that TiB<sub>2</sub> particles shield the Cu-rich phases in the boundaries of α-Al grains, presumably acting as a physical barrier to the diffusion of Cu solutes toward α-Al grains. The model also suggests that the effective diffusion coefficient of Cu in Al, in the presence of TiB<sub>2</sub> particles, reduced by a factor of 2.0–2.5 in the A205 alloy compared with the binary Al-Cu alloy.https://www.mdpi.com/2075-4701/10/7/900Al-Cu alloyA205solution heat treatmentTiB2 particlesdiffusion-based model
collection DOAJ
language English
format Article
sources DOAJ
author Mohammadreza Zamani
Ilia Belov
Emma Sjölander
Anton Bjurenstedt
Ehsan Ghassemali
Salem Seifeddine
spellingShingle Mohammadreza Zamani
Ilia Belov
Emma Sjölander
Anton Bjurenstedt
Ehsan Ghassemali
Salem Seifeddine
Study on Dissolution of Al<sub>2</sub>Cu in Al-4.3Cu and A205 Cast Alloys
Metals
Al-Cu alloy
A205
solution heat treatment
TiB2 particles
diffusion-based model
author_facet Mohammadreza Zamani
Ilia Belov
Emma Sjölander
Anton Bjurenstedt
Ehsan Ghassemali
Salem Seifeddine
author_sort Mohammadreza Zamani
title Study on Dissolution of Al<sub>2</sub>Cu in Al-4.3Cu and A205 Cast Alloys
title_short Study on Dissolution of Al<sub>2</sub>Cu in Al-4.3Cu and A205 Cast Alloys
title_full Study on Dissolution of Al<sub>2</sub>Cu in Al-4.3Cu and A205 Cast Alloys
title_fullStr Study on Dissolution of Al<sub>2</sub>Cu in Al-4.3Cu and A205 Cast Alloys
title_full_unstemmed Study on Dissolution of Al<sub>2</sub>Cu in Al-4.3Cu and A205 Cast Alloys
title_sort study on dissolution of al<sub>2</sub>cu in al-4.3cu and a205 cast alloys
publisher MDPI AG
series Metals
issn 2075-4701
publishDate 2020-07-01
description Evolution of microstructure in a binary Al-Cu system (Al-4.3Cu) and a commercially alloyed Al-Cu system (A205) during solution heat treatment was investigated using optical microscopy (OM), scanning electron microscopy (SEM), wavelength-dispersive X-ray spectroscopy (WDS), and differential scanning calorimetry (DSC). The diversified coarseness of the microstructure was initiated by controlling the solidification rate. Different solution treatment temperatures were applied to identify a proper solutioning temperature. The larger microstructural scale required an increased solutioning temperature and prolonged holding time to obtain homogenized solutes in the α-Al matrix. The diffusion of Cu primarily controlled the solution heat treatment process. A diffusion-based model was applied and calibrated to determine the dissolution rate of an Al<sub>2</sub>Cu particle in the matrix. The model operates on a similar time scale with the experimental results for the Al-4.3Cu and A205 alloys with various microstructural scales, different chemical compositions, and at different solution treatment temperatures. Three-dimensional (3D) reconstructed images from SEM images and energy dispersive spectroscopy (EDS) map of elements showed that TiB<sub>2</sub> particles shield the Cu-rich phases in the boundaries of α-Al grains, presumably acting as a physical barrier to the diffusion of Cu solutes toward α-Al grains. The model also suggests that the effective diffusion coefficient of Cu in Al, in the presence of TiB<sub>2</sub> particles, reduced by a factor of 2.0–2.5 in the A205 alloy compared with the binary Al-Cu alloy.
topic Al-Cu alloy
A205
solution heat treatment
TiB2 particles
diffusion-based model
url https://www.mdpi.com/2075-4701/10/7/900
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