High Density Packaging Technology

High Density Packaging Technology

Bibliographic Details
Main Authors:	Kazuo Mizuno, Yusaku Nishi
Format:	Article
Language:	English
Published:	Hindawi Limited 1981-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.9.3

Similar Items

Tape Automated Bonding for High Density Packaging
by: Karel Kurzweil
Published: (1981-01-01)

The Research of the MEMS Package with High Density Vertical Wiring Process
by: Sheng Pei Wu, et al.
Published: (2001)

Study of high density lead frame design assemble package
by: Che-Chin Chang, et al.
Published: (2008)

Packaging of a High Power Density Point of Load Converter
by: Gilham, David Joel
Published: (2013)

The benchden Package: Benchmark Densities for Nonparametric Density Estimation
by: Thoralf Mildenberger, et al.
Published: (2012-01-01)

Packaging Development of Thermoelectric Energy Generator with High Area Density of Thermocouples
by: Yao-ShengHsu, et al.
Published: (2018)

Electroplated Compliant High-Density Interconnects For Next-Generation Microelectronic Packaging
by: Lo, George Chih-Yu
Published: (2005)

On packaging techniques for a high power density DC/DC converter
by: Gerber, Mark Benjamin
Published: (2009)

New Carbon-Silicon Carbide Composite Board Material for High Density and High Reliability Packaging
by: Kumbhat, Nitesh
Published: (2005)

High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging
by: Ok, Seong Joon
Published: (2007)

Anticounterfeit packaging technologies
by: Ruchir Y Shah, et al.
Published: (2010-01-01)

Characterization of Nanostructured Metals and Metal Nanowires for Ultra-High Density Chip-to-Package Interconnections
by: Bansal, Shubhra
Published: (2007)

Fatigue Life Predictions of the Lead-Free Solder Joints on High-Density PBGA Packages
by: 黃苑洛
Published: (2009)

Application of Package On Package Technology on BGA Rework Process
by: Wang, Szu-Po, et al.
Published: (2011)

Will Product Packaging Density Affect Pre-Purchase Recognition?
by: Taebeum Ryu, et al.
Published: (2019-08-01)

Photothermal characterization of low density polyethylene food packages
by: Poley Luiz H., et al.
Published: (2004-01-01)

Reovirus Low-Density Particles Package Cellular RNA
by: Timothy W. Thoner, et al.
Published: (2021-06-01)

A Minimal Volume Hermetic Packaging Design for High-Energy-Density Micro-Energy Systems
by: Xiujun Yue, et al.
Published: (2020-05-01)

Analysis of high density interconnect alternatives in multichip module packaging using the analytic hierarchy process
by: Grau, Peter F.
Published: (2014)

Food Packaging. Materials and Technologies
Published: (2019)

Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology
by: Yixiong Yan, et al.
Published: (2021-05-01)

The Lead-frame Based Package Technology of High Definition MEMS Microphone
by: Min-Te Tu, et al.

High voltage packaging technology for wide bandgap power semiconductor devices
by: Rashid, Suhail Jeremy
Published: (2008)

Biodegradability Study of the Blend Film of High Density Polyethylene and Poly(lactic acid) Disposable Packages Flake
by: Elahe Baghi Neirizi, et al.
Published: (2016-03-01)

An integrated process modeling methodology and module for sequential multilayered high-density substrate fabrication for microelectronic packages
by: Dunne, Rajiv Carl
Published: (2007)

Comparison on Creep Behaviors and Fatigue Strength Prediction of Lead-Free Solder Joint in High Density Packages
by: Ching-Tzu Huang, et al.

kdecopula: An R Package for the Kernel Estimation of Bivariate Copula Densities
by: Thomas Nagler
Published: (2018-04-01)

Food Processing and Packaging Technologies Recent Advances
Published: (2023)

Power cycling capability of advanced packaging and interconnection technologies at high temperature swings
by: Amro, Raed
Published: (2006)

Power cycling capability of advanced packaging and interconnection technologies at high temperature swings
by: Amro, Raed
Published: (2006)

Novel Package of High Power LEDs Applied by Electroless- and Electro- plating Technology
by: Ruei-Teng Lin, et al.
Published: (2007)

The Techniques and Aspects of Green Packaging Design Applied to High Technology Electronics Industry
by: ChiaJung Hsieh, et al.
Published: (2010)

The Development of Flip-Chip Package Technology for High Frequency GaAs Device Applications
by: Shin Chen Huang, et al.
Published: (2002)

HIGH POWER LIGHT EMITTING DIODES PACKAGE TECHNOLOGY AND FOR ANALYSIS HEAT DISSIPATION
by: Wang-Ken Tseng, et al.
Published: (2012)

IC Packaging Technology for Electronic Watches
by: Yoshio Iinuma
Published: (1981-01-01)

Recent Developments in Seafood Packaging Technologies
by: Michael G. Kontominas, et al.
Published: (2021-04-01)

The use of modified packaging in the technology of butter
by: L. V. Golubeva, et al.
Published: (2017-11-01)

The location technology for laser diodes packaging
by: Min-Hua Kang, et al.
Published: (2010)

Study of Integration Technology for Stacking Package
by: Ming-Hsiang Cheng, et al.
Published: (2007)

MaskDensity14: An R package for the density approximant of a univariate based on noise multiplied data
by: Yan-Xia Lin, et al.
Published: (2015-12-01)

Cannot write session to /tmp/vufind_sessions/sess_gg1vsriosjoba23kd87ii0nq58