Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic s...

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Bibliographic Details
Main Authors:	Gyuwon Jeong, Dong-Yurl Yu, Seongju Baek, Junghwan Bang, Tae-Ik Lee, Seung-Boo Jung, JungSoo Kim, Yong-Ho Ko
Format:	Article
Language:	English
Published:	MDPI AG 2021-01-01
Series:	Materials
Subjects:	low-temperature bonding laser process Ag nanoparticle (Ag NP) interfacial reaction intermetallic compounds (IMCs) mechanical property
Online Access:	https://www.mdpi.com/1996-1944/14/2/335

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