Integrated closed cooling system for high-power chips

• Main Authors: Rui Wang, Jiyu Qian, Tao Wei, Haojie Huang
• Format: Article
• Language: English
• Published: Elsevier 2021-08-01
• Series: Case Studies in Thermal Engineering
• Subjects: Cooling architecture; High-power chips; Micro-channel; Heat dissipation
• Online Access: http://www.sciencedirect.com/science/article/pii/S2214157X21001179

With the innovation of high power and high integration for chips in microwave devices, the research of high-efficiency integrated cooling system is advancing. Current cooling architecture has disadvantages of poor impurity tolerance, large terminal heat exchanger, and low system reliability. An integrated closed cooling system is proposed to conquer cooling problems in radio frequency microsystem. A principle prototype of the closed cooling system is established, integrated with micropump, heat exchanger, and silicon based micro-channel substrate. A heat flux of 500 W/cm2 for high-power chip cooling is achieved with temperature rise less than 50 °C, which demonstrates high efficiency and reliability of present integrated closed cooling system.