Integrated closed cooling system for high-power chips
With the innovation of high power and high integration for chips in microwave devices, the research of high-efficiency integrated cooling system is advancing. Current cooling architecture has disadvantages of poor impurity tolerance, large terminal heat exchanger, and low system reliability. An inte...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-08-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X21001179 |