Metallization and Diffusion Bonding of CoSb<sub>3</sub>-Based Thermoelectric Materials

Metallization and Diffusion Bonding of CoSb<sub>3</sub>-Based Thermoelectric Materials

CoSb<sub>3</sub>-based skutterudite alloy is one of the most promising thermoelectric materials in the middle temperature range (room temperature&#8212;550 &#176;C). However, the realization of an appropriate metallization layer directly on the sintered skutterudite pellet is ind...

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Bibliographic Details
Main Authors: Hangbin Feng, Lixia Zhang, Jialun Zhang, Wenqin Gou, Sujuan Zhong, Guanxing Zhang, Huiyuan Geng, Jicai Feng
Format: Article
Language:English
Published: MDPI AG 2020-03-01
Series:Materials
Subjects:
thermoelectric materials
joining
skutterudite alloy
co-mo metallization layer
Online Access:https://www.mdpi.com/1996-1944/13/5/1130

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https://www.mdpi.com/1996-1944/13/5/1130

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