Research and Analysis of MEMS Switches in Different Frequency Bands

Due to their high isolation, low insertion loss, high linearity, and low power consumption, microelectromechanical systems (MEMS) switches have drawn much attention from researchers in recent years. In this paper, we introduce the research status of MEMS switches in different bands and several relia...

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Main Authors: Wenchao Tian, Ping Li, LinXiao Yuan
Format: Article
Language:English
Published: MDPI AG 2018-04-01
Series:Micromachines
Subjects:
Online Access:http://www.mdpi.com/2072-666X/9/4/185
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spelling doaj-3c9aa4bcad45455686a14178b5af244d2020-11-25T00:43:26ZengMDPI AGMicromachines2072-666X2018-04-019418510.3390/mi9040185mi9040185Research and Analysis of MEMS Switches in Different Frequency BandsWenchao Tian0Ping Li1LinXiao Yuan2School of Electro-Mechanical Engineering, Xidian University, Number 2 Taibai South Road, Xi’an 710071, ChinaSchool of Electro-Mechanical Engineering, Xidian University, Number 2 Taibai South Road, Xi’an 710071, ChinaSchool of Electro-Mechanical Engineering, Xidian University, Number 2 Taibai South Road, Xi’an 710071, ChinaDue to their high isolation, low insertion loss, high linearity, and low power consumption, microelectromechanical systems (MEMS) switches have drawn much attention from researchers in recent years. In this paper, we introduce the research status of MEMS switches in different bands and several reliability issues, such as dielectric charging, contact failure, and temperature instability. In this paper, some of the following methods to improve the performance of MEMS switches in high frequency are summarized: (1) utilizing combinations of several switches in series; (2) covering a float metal layer on the dielectric layer; (3) using dielectric layer materials with high dielectric constants and conductor materials with low resistance; (4) developing MEMS switches using T-match and π-match; (5) designing MEMS switches based on bipolar complementary metal–oxide–semiconductor (BiCMOS) technology and reconfigurable MEMS’ surfaces; (6) employing thermal compensation structures, circularly symmetric structures, thermal buckle-beam actuators, molybdenum membrane, and thin-film packaging; (7) selecting Ultra-NanoCrystalline diamond or aluminum nitride dielectric materials and applying a bipolar driving voltage, stoppers, and a double-dielectric-layer structure; and (8) adopting gold alloying with carbon nanotubes (CNTs), hermetic and reliable packaging, and mN-level contact.http://www.mdpi.com/2072-666X/9/4/185microelectromechanical systems (MEMS) switchisolationinsertion lossdielectric chargingcontact failuretemperature-stable
collection DOAJ
language English
format Article
sources DOAJ
author Wenchao Tian
Ping Li
LinXiao Yuan
spellingShingle Wenchao Tian
Ping Li
LinXiao Yuan
Research and Analysis of MEMS Switches in Different Frequency Bands
Micromachines
microelectromechanical systems (MEMS) switch
isolation
insertion loss
dielectric charging
contact failure
temperature-stable
author_facet Wenchao Tian
Ping Li
LinXiao Yuan
author_sort Wenchao Tian
title Research and Analysis of MEMS Switches in Different Frequency Bands
title_short Research and Analysis of MEMS Switches in Different Frequency Bands
title_full Research and Analysis of MEMS Switches in Different Frequency Bands
title_fullStr Research and Analysis of MEMS Switches in Different Frequency Bands
title_full_unstemmed Research and Analysis of MEMS Switches in Different Frequency Bands
title_sort research and analysis of mems switches in different frequency bands
publisher MDPI AG
series Micromachines
issn 2072-666X
publishDate 2018-04-01
description Due to their high isolation, low insertion loss, high linearity, and low power consumption, microelectromechanical systems (MEMS) switches have drawn much attention from researchers in recent years. In this paper, we introduce the research status of MEMS switches in different bands and several reliability issues, such as dielectric charging, contact failure, and temperature instability. In this paper, some of the following methods to improve the performance of MEMS switches in high frequency are summarized: (1) utilizing combinations of several switches in series; (2) covering a float metal layer on the dielectric layer; (3) using dielectric layer materials with high dielectric constants and conductor materials with low resistance; (4) developing MEMS switches using T-match and π-match; (5) designing MEMS switches based on bipolar complementary metal–oxide–semiconductor (BiCMOS) technology and reconfigurable MEMS’ surfaces; (6) employing thermal compensation structures, circularly symmetric structures, thermal buckle-beam actuators, molybdenum membrane, and thin-film packaging; (7) selecting Ultra-NanoCrystalline diamond or aluminum nitride dielectric materials and applying a bipolar driving voltage, stoppers, and a double-dielectric-layer structure; and (8) adopting gold alloying with carbon nanotubes (CNTs), hermetic and reliable packaging, and mN-level contact.
topic microelectromechanical systems (MEMS) switch
isolation
insertion loss
dielectric charging
contact failure
temperature-stable
url http://www.mdpi.com/2072-666X/9/4/185
work_keys_str_mv AT wenchaotian researchandanalysisofmemsswitchesindifferentfrequencybands
AT pingli researchandanalysisofmemsswitchesindifferentfrequencybands
AT linxiaoyuan researchandanalysisofmemsswitchesindifferentfrequencybands
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