Formation CMOS Schemes on GaAs with Self-Aligned Nitride and Silicide Gates
Advanced integrated logic circuits on GaAs are mainly based on the using of n-channel field-effect transistors with gate Schottky (MESFET). To create the complementary MESFET integrated circuits the main problem is quite small Schottky barrier height (< 0,5 eV) on p-type gallium arsenide. One...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Vasyl Stefanyk Precarpathian National University
2016-10-01
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| Series: | Фізика і хімія твердого тіла |
| Online Access: | http://journals.pu.if.ua/index.php/pcss/article/view/773 |
| Summary: | Advanced integrated logic circuits on GaAs are mainly based on the using of n-channel field-effect transistors with gate Schottky (MESFET). To create the complementary MESFET integrated circuits the main problem is quite small Schottky barrier height (< 0,5 eV) on p-type gallium arsenide. One way to solve this problem is to use a nitride or silicide tungsten compounds to form gates given the thickness and composition. This paper highlights the features of the formation of complementary high-speed logic circuits on the pGaAs with self-aligned gate based on nitride or silicide of tungsten obtained by reduced pressure horizontal reactor "Izotron 4" and of RF magnetron sputtering equipment "Oratorio-5." This technology can also be used to form a Schottky contact to n- channel MESFET. Since the manufacturing process of MESFET self-aligned gate provides using refractory gate material as a mask for the multiply ion implantation, the Schottky contact must withstand subsequent high-temperature heat treatment required to activate implanted impurities. In this connection, the action of high-temperature photonic and resistive heating on the barrier height of Schottky contact formed by nitride (silicide) tungsten (WNx, WSix) GaAs was also studied. |
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| ISSN: | 1729-4428 2309-8589 |