Optimization of the composition in a composite material for microelectronics application using the Ising model
Abstract Tailored material is necessary in many industrial applications since material properties directly determine the characteristics of components. However, the conventional trial and error approach is costly and time-consuming. Therefore, materials informatics is expected to overcome these draw...
Main Authors: | Yoshihiko Imanaka, Toshihisa Anazawa, Fumiaki Kumasaka, Hideyuki Jippo |
---|---|
Format: | Article |
Language: | English |
Published: |
Nature Publishing Group
2021-02-01
|
Series: | Scientific Reports |
Online Access: | https://doi.org/10.1038/s41598-021-81243-2 |
Similar Items
-
Thermochemical modeling of composite materials for base substrate applications in microelectronic systems
by: Bassett, Julien
Published: (2007) -
Nanostructured Materials for Microelectronic Applications
by: Shoou-Jinn Chang, et al.
Published: (2014-01-01) -
The application of Cu-Ag submicron composite particles in microelectronic bonding
by: Ching-Huan Hsiao, et al.
Published: (2015) -
New organic materials for microelectronics applications
by: Wright-Williams, Lorna M.
Published: (2008) -
Investigation of the curing process of an epoxy/silica composite for microelectronics
by: Granado, Lérys
Published: (2017)