Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits
This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs). These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit mod...
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doaj-32b79ad0ae384428bbb38c3d6e1f03082020-11-25T00:38:34ZengMDPI AGApplied Sciences2076-34172018-03-018447710.3390/app8040477app8040477Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated CircuitsDomenico Capriglione0Andrea G. Chiariello1Antonio Maffucci2Department of Industrial Engineering, University of Salerno, Campus di Fisciano, 84084 Fisciano, ItalyDepartment of Engineering, University della Campania L. Vanvitelli, Via Roma 29, 81031 Aversa, ItalyDepartment of Electrical and Information Engineering, University of Cassino and Southern Lazio, via G. Di Biasio 43, 03043 Cassino, ItalyThis paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs). These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc.), based on the Integrated Circuit Emission Model template (ICEM). As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.http://www.mdpi.com/2076-3417/8/4/477electromagnetic compatibilityintegrated circuitsEMI modelingconducted emissionradiated emission |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Domenico Capriglione Andrea G. Chiariello Antonio Maffucci |
spellingShingle |
Domenico Capriglione Andrea G. Chiariello Antonio Maffucci Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits Applied Sciences electromagnetic compatibility integrated circuits EMI modeling conducted emission radiated emission |
author_facet |
Domenico Capriglione Andrea G. Chiariello Antonio Maffucci |
author_sort |
Domenico Capriglione |
title |
Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits |
title_short |
Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits |
title_full |
Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits |
title_fullStr |
Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits |
title_full_unstemmed |
Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits |
title_sort |
accurate models for evaluating the direct conducted and radiated emissions from integrated circuits |
publisher |
MDPI AG |
series |
Applied Sciences |
issn |
2076-3417 |
publishDate |
2018-03-01 |
description |
This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs). These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc.), based on the Integrated Circuit Emission Model template (ICEM). As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions. |
topic |
electromagnetic compatibility integrated circuits EMI modeling conducted emission radiated emission |
url |
http://www.mdpi.com/2076-3417/8/4/477 |
work_keys_str_mv |
AT domenicocapriglione accuratemodelsforevaluatingthedirectconductedandradiatedemissionsfromintegratedcircuits AT andreagchiariello accuratemodelsforevaluatingthedirectconductedandradiatedemissionsfromintegratedcircuits AT antoniomaffucci accuratemodelsforevaluatingthedirectconductedandradiatedemissionsfromintegratedcircuits |
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