Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP Crystal

As a soft-brittle material, the machined surface quality of potassium dihydrogen phosphate (KDP) crystal is heavily affected by the edge quality of the diamond cutting tool. However, nanoscale micro defects inevitably occur on the freshly sharpened tool edge, and the machining mechanism for KDP crys...

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Main Authors: Shuo Zhang, Wenjun Zong
Format: Article
Language:English
Published: MDPI AG 2020-12-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/11/12/1102
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spelling doaj-2f6e7733b95946c9a6d762115de0037f2020-12-15T00:02:43ZengMDPI AGMicromachines2072-666X2020-12-01111102110210.3390/mi11121102Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP CrystalShuo Zhang0Wenjun Zong1Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, ChinaCenter for Precision Engineering, Harbin Institute of Technology, Harbin 150001, ChinaAs a soft-brittle material, the machined surface quality of potassium dihydrogen phosphate (KDP) crystal is heavily affected by the edge quality of the diamond cutting tool. However, nanoscale micro defects inevitably occur on the freshly sharpened tool edge, and the machining mechanism for KDP crystal remains unclear. Therefore, in this work, three types of tool-edge micro defects are classified according to their cross-sections, including the blunt-edge, crescent-edge, and flat-edge micro defects. Moreover, the smoothed particle hydrodynamics (SPH) method is employed to reveal the material removal mechanism of KDP crystal with consideration of different tool-edge micro defects, and the flat-edge micro defects are subdivided into flat edge A (similar to flank wear) and flat edge B (similar to chamfered edge) on the basis of their effects in machining. The simulation results indicate that the surfaces machined by crescent edge and flat edge A are unsmooth with large-size defects due to the disappearance of hydrostatic pressure beneath the cutting edge. As for the blunt edge and flat edge B, the machined surfaces are smooth with a favorable increment of hydrostatic pressure for processing brittle materials, which indicates that a solution to eliminate the tool-edge micro defects is necessary, e.g., the passivation method. For keeping the cutting edge as sharp as possible in removing the tool-edge micro defects completely by passivation, the effect of tool shank depression angles on the geometries of the passivated cutting edge is investigated, and a high-quality cutting edge with a micro chamfered edge is obtained after passivation at a depression angle of 60° and re-sharpening of the rake face. Finally, the tool cutting performance after passivation is validated through fly-cutting experiments of KDP crystal. The chamfered edge can produce the best defect-free surface with the minimum surface roughness.https://www.mdpi.com/2072-666X/11/12/1102tool-edge micro defectsSPH methodpassivation methodchamfered edgeKDP crystal
collection DOAJ
language English
format Article
sources DOAJ
author Shuo Zhang
Wenjun Zong
spellingShingle Shuo Zhang
Wenjun Zong
Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP Crystal
Micromachines
tool-edge micro defects
SPH method
passivation method
chamfered edge
KDP crystal
author_facet Shuo Zhang
Wenjun Zong
author_sort Shuo Zhang
title Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP Crystal
title_short Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP Crystal
title_full Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP Crystal
title_fullStr Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP Crystal
title_full_unstemmed Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP Crystal
title_sort micro defects on diamond tool cutting edge affecting the ductile-mode machining of kdp crystal
publisher MDPI AG
series Micromachines
issn 2072-666X
publishDate 2020-12-01
description As a soft-brittle material, the machined surface quality of potassium dihydrogen phosphate (KDP) crystal is heavily affected by the edge quality of the diamond cutting tool. However, nanoscale micro defects inevitably occur on the freshly sharpened tool edge, and the machining mechanism for KDP crystal remains unclear. Therefore, in this work, three types of tool-edge micro defects are classified according to their cross-sections, including the blunt-edge, crescent-edge, and flat-edge micro defects. Moreover, the smoothed particle hydrodynamics (SPH) method is employed to reveal the material removal mechanism of KDP crystal with consideration of different tool-edge micro defects, and the flat-edge micro defects are subdivided into flat edge A (similar to flank wear) and flat edge B (similar to chamfered edge) on the basis of their effects in machining. The simulation results indicate that the surfaces machined by crescent edge and flat edge A are unsmooth with large-size defects due to the disappearance of hydrostatic pressure beneath the cutting edge. As for the blunt edge and flat edge B, the machined surfaces are smooth with a favorable increment of hydrostatic pressure for processing brittle materials, which indicates that a solution to eliminate the tool-edge micro defects is necessary, e.g., the passivation method. For keeping the cutting edge as sharp as possible in removing the tool-edge micro defects completely by passivation, the effect of tool shank depression angles on the geometries of the passivated cutting edge is investigated, and a high-quality cutting edge with a micro chamfered edge is obtained after passivation at a depression angle of 60° and re-sharpening of the rake face. Finally, the tool cutting performance after passivation is validated through fly-cutting experiments of KDP crystal. The chamfered edge can produce the best defect-free surface with the minimum surface roughness.
topic tool-edge micro defects
SPH method
passivation method
chamfered edge
KDP crystal
url https://www.mdpi.com/2072-666X/11/12/1102
work_keys_str_mv AT shuozhang microdefectsondiamondtoolcuttingedgeaffectingtheductilemodemachiningofkdpcrystal
AT wenjunzong microdefectsondiamondtoolcuttingedgeaffectingtheductilemodemachiningofkdpcrystal
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