Open Localization in 3D Package with TSV Daisy Chain Using Magnetic Field Imaging and High-Resolution Three-Dimensional X-ray Microscopy

Open Localization in 3D Package with TSV Daisy Chain Using Magnetic Field Imaging and High-Resolution Three-Dimensional X-ray Microscopy

With the development of 3D integrated packaging technology, failure analysis is facing more and more challenges. Defect localization in a 3D package is a key step of failure analysis. The complex structure and materials of 3D package devices demand non-destructive defect localization technology for...

Full description

Bibliographic Details
Main Authors: Yuan Chen, Ping Lai, Hong-Zhong Huang, Peng Zhang, Xiaoling Lin
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Applied Sciences
Subjects:
magnetic field imaging (MFI)
3D X-ray
failure analysis
defect localization
TSV
non-destructive
Online Access:https://www.mdpi.com/2076-3417/11/17/8148

Similar Items

Similar Items