A Study on the Influence of the Cross-Sectional Shape of the Metal-Inserted Retainer Ring and the Pressure Distribution from the Multi-Zone Carrier Head to Increase the Wafer Yield

A Study on the Influence of the Cross-Sectional Shape of the Metal-Inserted Retainer Ring and the Pressure Distribution from the Multi-Zone Carrier Head to Increase the Wafer Yield

In this paper, for the purpose of increasing the wafer yield by controlling the non-uniformity of the material removal rate during the chemical mechanical polishing process, the influence of the cross-sectional shape of the metal-inserted retainer ring and the pressure distribution on the wafer and...

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Bibliographic Details
Main Authors: Joon-Yeon Park, Je-Heon Han, Changwon Kim
Format: Article
Language:English
Published: MDPI AG 2020-11-01
Series:Applied Sciences
Subjects:
chemical mechanical polishing
finite element method
retainer ring
Online Access:https://www.mdpi.com/2076-3417/10/23/8362

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