Optimal design scheme based on the segmental transmission line methodology for high-frequency interconnection in 3D micro/nano integration
With the continuous growth of signal frequency and package density, discontinuity of the high-frequency interconnection in 3D micro/nano integration becomes unavoidable, which results in serious signal integrity problems. Traditional interconnection design schemes, such as termination and shielding/...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2020-09-01
|
| Series: | Nanotechnology and Precision Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589554020300283 |