Study of one-dimensional cure simulation applicable conditions for thick laminates and its comparison with three-dimensional simulation
The comparison of one- and three-dimensional cure simulation of thick thermoset matrix laminates was conducted in this study. The applicable conditions of one-dimensional cure simulation were investigated. The transient heat conduction equation coupled to the cure kinetics was solved numerically usi...
Main Authors: | Ren Mingfa, Wang Qi, Cong Jie, Chang Xin |
---|---|
Format: | Article |
Language: | English |
Published: |
De Gruyter
2018-11-01
|
Series: | Science and Engineering of Composite Materials |
Subjects: | |
Online Access: | https://doi.org/10.1515/secm-2017-0244 |
Similar Items
-
On the Nature of Epoxy Resin Post-Curing
by: James C. Moller, et al.
Published: (2020-02-01) -
Experimental investigation for modeling the hardening of thermosetting polymers during curing
by: Bilen Emek Abali, et al.
Published: (2021-10-01) -
Effect of cure cycle on curing process and hardness for epoxy resin
Published: (2009-09-01) -
Evaluation of Phenol Formaldehyde Resin Cure Rate
by: Scott, Brian Cameron
Published: (2014) -
EVALUATION OF DIELECTRIC CURING MONITORING INVESTIGATING LIGHT-CURING DENTAL FILLING COMPOSITES
by: Johannes Steinhaus, et al.
Published: (2011-05-01)