Diffusion Bonding of 1420 Al–Li Alloy Assisted by Pure Aluminum Foil as Interlayer

• Main Authors: Fan Wu, Wei Chen, Bing Zhao, Hongliang Hou, Wenlong Zhou, Zhiqiang Li
• Format: Article
• Language: English
• Published: MDPI AG 2020-03-01
• Series: Materials
• Subjects: diffusion bonding; interface microstructure; shear strength; interlayer
• Online Access: https://www.mdpi.com/1996-1944/13/5/1103

The Al−Li alloy is becoming popular for aerospace application owing to their low density, high specific strength, good corrosion resistance, etc. The diffusion bonding/superplastic forming (DB/SPF) structure of titanium alloy has been widely used in the aerospace industry. In order to broaden the application of Al−Li alloy, it is necessary to develop its diffusion bonding and superplastic forming (DB/SPF) technology. In the present study, diffusion bonding of 1420 Al−Li alloy assisted by pure aluminum foil was conducted on Gleeble-3500 thermal simulation system under different bonding parameters, the results show that the bonding temperatures have direct influence on the interface microstructure and bond strength of joints. Meanwhile, when the pure aluminum interlayer was introduced into the diffusion bonding process, the alloying element diffusion across the bond can improve the interface integrity and the mechanical properties. The joint formation mechanism with interlayer was investigated in detail, the development and application of this method was explored.