EVALUACIÓN TÉRMICA DEL CURADO DE ADHESIVOS BASE SBR USANDO PERÓXIDO DE DICUMILO
Curing is an important process in adhesive formulation, but scant reports on the study of the kinetics of curing in adhesive are currently available, particularly for formulations including styrene-butadiene copolymers. The focus of the present work was to thermodynamically quantify the curing react...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Sociedade Brasileira de Química
2015-05-01
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| Series: | Química Nova |
| Subjects: | |
| Online Access: | http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0100-40422015000500651&lng=en&tlng=en |