Analyzing the Effect of Particle Shape on Deformation Mechanism during Cutting Simulation of SiC P/Al Composites

To analyze the effect of particle shape on deformational behavior in the cutting simulation process for metal matrix composites (MMCs), two 2D mesoscopic-based finite element (FE) models reinforced with randomly distributed circular and irregular polygonal particles were developed. Different materia...

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Bibliographic Details
Main Authors: Jiakang Zhou, Jieqiong Lin, Mingming Lu, Xian Jing, Yubo Jin, Dunlan Song
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/12/8/953
Description
Summary:To analyze the effect of particle shape on deformational behavior in the cutting simulation process for metal matrix composites (MMCs), two 2D mesoscopic-based finite element (FE) models reinforced with randomly distributed circular and irregular polygonal particles were developed. Different material properties (metal matrix phase, particle reinforced phase) and the properties of the particle–matrix interface were comprehensively considered in the proposed FE model. Systematic cutting experiments were conducted to compare the differences between two modeling approaches with respect to particle fracture, chip formation, cutting force and surface integrity. The results show that the irregular polygonal particle model is closer to the microstructure of MMCs, and is better able to reflect the deformation behavior of particles. The simulation model with irregular polygonal particles is even able to capture more details of the impact caused by particles, reflecting variations in the cutting force in the actual cutting process. The initiation and propagation of microcracks is mainly determined on the basis of particle geometry and further affects chip formation. Both models are able to correctly reflect surface defects, but the irregular polygonal particle model provides a more comprehensive prediction for the subsurface damage of MMCs.
ISSN:2072-666X