A critical review of constitutive models for solders in electronic packaging
Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solde...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2017-08-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1177/1687814017714976 |