Fast and Accurate Temperature-Dependent Current Modeling of HBTs Using the Dimension Reduction Method

Empirical models have been widely and successfully used in device modeling in the past few decades. However, they are becoming increasingly intricate to accurately capture the complex thermal effects in semiconductor devices. Therefore, the aim of this work is to utilize a general dimension-reductio...

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Main Authors: Wenrui Hu, Andong Huang, Haorui Luo, Yong-Xin Guo
Format: Article
Language:English
Published: IEEE 2019-01-01
Series:IEEE Access
Subjects:
HBT
Online Access:https://ieeexplore.ieee.org/document/8886403/
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spelling doaj-264fd91e5f4e4905ba1f7d98d65df26f2021-03-30T00:42:34ZengIEEEIEEE Access2169-35362019-01-01716085816086910.1109/ACCESS.2019.29501798886403Fast and Accurate Temperature-Dependent Current Modeling of HBTs Using the Dimension Reduction MethodWenrui Hu0https://orcid.org/0000-0001-5514-4130Andong Huang1https://orcid.org/0000-0002-8592-0855Haorui Luo2Yong-Xin Guo3Department of Electrical and Computer Engineering, National University of Singapore, SingaporeNational University of Singapore Suzhou Research Institute, Suzhou, ChinaNational University of Singapore Suzhou Research Institute, Suzhou, ChinaDepartment of Electrical and Computer Engineering, National University of Singapore, SingaporeEmpirical models have been widely and successfully used in device modeling in the past few decades. However, they are becoming increasingly intricate to accurately capture the complex thermal effects in semiconductor devices. Therefore, the aim of this work is to utilize a general dimension-reduction method to quickly and accurately construct large-signal models of semiconductor devices with consideration of thermal effects. In general, the junction voltage dimension is represented by empirical functions, whereas the junction temperature dimension is described by the first-order Taylor series approximation. The final analytical current model is a combination of two independent sets of empirical functions. These functions are constructed from pulsed I-V measurements at different ambient temperatures. The percentages of different components are controlled by the thermal level. Two commercial InGaP/GaAs heterojunction bipolar transistors are investigated to verify the effectiveness of this method. The large-signal models are implemented in Advanced Design System. Excellent agreement is achieved between measurement and simulation of the I-V characteristics, S-parameters, and power sweeps. The dimension reduction method is able to effectively reduce the number of equations and parameters because the temperature dimension is expanded by using a Taylor series. In addition, this method would be applied to the thermal modeling of various devices based on new materials or process technologies. Accordingly, the dimension reduction method is powerful and useful in fast and accurate thermal modeling of microwave semiconductor devices.https://ieeexplore.ieee.org/document/8886403/Ambient temperaturedimension reductionempirical modelHBTlarge-signal modelself-heating
collection DOAJ
language English
format Article
sources DOAJ
author Wenrui Hu
Andong Huang
Haorui Luo
Yong-Xin Guo
spellingShingle Wenrui Hu
Andong Huang
Haorui Luo
Yong-Xin Guo
Fast and Accurate Temperature-Dependent Current Modeling of HBTs Using the Dimension Reduction Method
IEEE Access
Ambient temperature
dimension reduction
empirical model
HBT
large-signal model
self-heating
author_facet Wenrui Hu
Andong Huang
Haorui Luo
Yong-Xin Guo
author_sort Wenrui Hu
title Fast and Accurate Temperature-Dependent Current Modeling of HBTs Using the Dimension Reduction Method
title_short Fast and Accurate Temperature-Dependent Current Modeling of HBTs Using the Dimension Reduction Method
title_full Fast and Accurate Temperature-Dependent Current Modeling of HBTs Using the Dimension Reduction Method
title_fullStr Fast and Accurate Temperature-Dependent Current Modeling of HBTs Using the Dimension Reduction Method
title_full_unstemmed Fast and Accurate Temperature-Dependent Current Modeling of HBTs Using the Dimension Reduction Method
title_sort fast and accurate temperature-dependent current modeling of hbts using the dimension reduction method
publisher IEEE
series IEEE Access
issn 2169-3536
publishDate 2019-01-01
description Empirical models have been widely and successfully used in device modeling in the past few decades. However, they are becoming increasingly intricate to accurately capture the complex thermal effects in semiconductor devices. Therefore, the aim of this work is to utilize a general dimension-reduction method to quickly and accurately construct large-signal models of semiconductor devices with consideration of thermal effects. In general, the junction voltage dimension is represented by empirical functions, whereas the junction temperature dimension is described by the first-order Taylor series approximation. The final analytical current model is a combination of two independent sets of empirical functions. These functions are constructed from pulsed I-V measurements at different ambient temperatures. The percentages of different components are controlled by the thermal level. Two commercial InGaP/GaAs heterojunction bipolar transistors are investigated to verify the effectiveness of this method. The large-signal models are implemented in Advanced Design System. Excellent agreement is achieved between measurement and simulation of the I-V characteristics, S-parameters, and power sweeps. The dimension reduction method is able to effectively reduce the number of equations and parameters because the temperature dimension is expanded by using a Taylor series. In addition, this method would be applied to the thermal modeling of various devices based on new materials or process technologies. Accordingly, the dimension reduction method is powerful and useful in fast and accurate thermal modeling of microwave semiconductor devices.
topic Ambient temperature
dimension reduction
empirical model
HBT
large-signal model
self-heating
url https://ieeexplore.ieee.org/document/8886403/
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AT andonghuang fastandaccuratetemperaturedependentcurrentmodelingofhbtsusingthedimensionreductionmethod
AT haoruiluo fastandaccuratetemperaturedependentcurrentmodelingofhbtsusingthedimensionreductionmethod
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