Soldering of 7075 Aluminum Alloy using Ni-P and Cu-Cr Electrodeposited Interlayers

Soldering of 7075 Aluminum Alloy using Ni-P and Cu-Cr Electrodeposited Interlayers

Direct<b> </b>soldering of the aluminum alloy 7075 is very difficult or even impossible. In order to make it possible, galvanic coatings and the procedures for their application on alloy surfaces were developed. The paper presents structures and mechanical properties of soldered joints o...

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Bibliographic Details
Main Authors: Zbigniew Mirski, Ireneusz Ciepacz, and Tomasz Wojdat
Format: Article
Language:English
Published: MDPI AG 2020-09-01
Series:Materials
Subjects:
7075 aluminum alloy
soldering
electrodeposition
interlayer: Ni-P, Cu-Cr
Online Access:https://www.mdpi.com/1996-1944/13/18/4100

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