Densification: A Route towards Enhanced Thermal Conductivity of Epoxy Composites

When an amorphous polymer is cooled under pressure from above its glass transition temperature to room temperature, and then the pressure is released, this results in a densified state of the glass. This procedure applied to an epoxy composite system filled with boron nitride (BN) particles has been...

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Main Authors: Sasan Moradi, Frida Román, Yolanda Calventus, John M Hutchinson
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Polymers
Subjects:
Online Access:https://www.mdpi.com/2073-4360/13/2/286
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spelling doaj-23c0500431b040039beb7745f91d50f72021-01-18T00:01:00ZengMDPI AGPolymers2073-43602021-01-011328628610.3390/polym13020286Densification: A Route towards Enhanced Thermal Conductivity of Epoxy CompositesSasan Moradi0Frida Román1Yolanda Calventus2John M Hutchinson3Departament de Màquines i Motors Tèrmics, ESEIAAT, Universitat Politècnica de Catalunya, C/Colom 11, 08222 Terrassa, SpainDepartament de Màquines i Motors Tèrmics, ESEIAAT, Universitat Politècnica de Catalunya, C/Colom 11, 08222 Terrassa, SpainDepartament de Màquines i Motors Tèrmics, ESEIAAT, Universitat Politècnica de Catalunya, C/Colom 11, 08222 Terrassa, SpainDepartament de Màquines i Motors Tèrmics, ESEIAAT, Universitat Politècnica de Catalunya, C/Colom 11, 08222 Terrassa, SpainWhen an amorphous polymer is cooled under pressure from above its glass transition temperature to room temperature, and then the pressure is released, this results in a densified state of the glass. This procedure applied to an epoxy composite system filled with boron nitride (BN) particles has been shown to increase the density of the composite, reduce its enthalpy, and, most importantly, significantly enhance its thermal conductivity. An epoxy-BN composite with 58 wt% BN platelets of average size 30 µm has been densified by curing under pressures of up to 2.0 MPa and then cooling the cured sample to room temperature before releasing the pressure. It is found that the thermal conductivity is increased from approximately 3 W/mK for a sample cured at ambient pressure to approximately 7 W/mK; in parallel, the density increases from 1.55 to 1.72 ± 0.01 g/cm<sup>3</sup>. This densification process is much more effective in enhancing the thermal conductivity than is either simply applying pressure to consolidate the epoxy composite mixture before curing or applying pressure during cure but then removing the pressure before cooling to room temperature; this last procedure results in a thermal conductivity of approximately 5 W/mK. Furthermore, it has been shown that the densification and corresponding effect on the thermal conductivity is reversible; it can be removed by heating above the glass transition temperature and then cooling without pressure and can be reinstated by again heating above the glass transition temperature and then cooling under pressure. This implies that a densified state and an enhanced thermal conductivity can be induced even in a composite prepared without the use of pressure.https://www.mdpi.com/2073-4360/13/2/286thermal conductivityepoxy compositesboron nitridedensificationglass transitiondifferential scanning calorimetry (DSC)
collection DOAJ
language English
format Article
sources DOAJ
author Sasan Moradi
Frida Román
Yolanda Calventus
John M Hutchinson
spellingShingle Sasan Moradi
Frida Román
Yolanda Calventus
John M Hutchinson
Densification: A Route towards Enhanced Thermal Conductivity of Epoxy Composites
Polymers
thermal conductivity
epoxy composites
boron nitride
densification
glass transition
differential scanning calorimetry (DSC)
author_facet Sasan Moradi
Frida Román
Yolanda Calventus
John M Hutchinson
author_sort Sasan Moradi
title Densification: A Route towards Enhanced Thermal Conductivity of Epoxy Composites
title_short Densification: A Route towards Enhanced Thermal Conductivity of Epoxy Composites
title_full Densification: A Route towards Enhanced Thermal Conductivity of Epoxy Composites
title_fullStr Densification: A Route towards Enhanced Thermal Conductivity of Epoxy Composites
title_full_unstemmed Densification: A Route towards Enhanced Thermal Conductivity of Epoxy Composites
title_sort densification: a route towards enhanced thermal conductivity of epoxy composites
publisher MDPI AG
series Polymers
issn 2073-4360
publishDate 2021-01-01
description When an amorphous polymer is cooled under pressure from above its glass transition temperature to room temperature, and then the pressure is released, this results in a densified state of the glass. This procedure applied to an epoxy composite system filled with boron nitride (BN) particles has been shown to increase the density of the composite, reduce its enthalpy, and, most importantly, significantly enhance its thermal conductivity. An epoxy-BN composite with 58 wt% BN platelets of average size 30 µm has been densified by curing under pressures of up to 2.0 MPa and then cooling the cured sample to room temperature before releasing the pressure. It is found that the thermal conductivity is increased from approximately 3 W/mK for a sample cured at ambient pressure to approximately 7 W/mK; in parallel, the density increases from 1.55 to 1.72 ± 0.01 g/cm<sup>3</sup>. This densification process is much more effective in enhancing the thermal conductivity than is either simply applying pressure to consolidate the epoxy composite mixture before curing or applying pressure during cure but then removing the pressure before cooling to room temperature; this last procedure results in a thermal conductivity of approximately 5 W/mK. Furthermore, it has been shown that the densification and corresponding effect on the thermal conductivity is reversible; it can be removed by heating above the glass transition temperature and then cooling without pressure and can be reinstated by again heating above the glass transition temperature and then cooling under pressure. This implies that a densified state and an enhanced thermal conductivity can be induced even in a composite prepared without the use of pressure.
topic thermal conductivity
epoxy composites
boron nitride
densification
glass transition
differential scanning calorimetry (DSC)
url https://www.mdpi.com/2073-4360/13/2/286
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