Isolation of kinetic and spatial properties of uni-axial dynamic tensile loading of OFHC copper
Materials performance is recognized as being central to many emergent technologies. Future technologies will place increasing demands on materials performance with respect to extremes in stress, strain, temperature, and pressure. In this study, the dynamic ductile damage evolution of OFHC Cu is expl...
Main Authors: | , , , , , , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
EDP Sciences
2012-08-01
|
Series: | EPJ Web of Conferences |
Online Access: | http://dx.doi.org/10.1051/epjconf/20122601040 |