Au maskless patterning for vacuum packaging using the electrochemical method
The interconnection of wires is an important issue in vacuum-packaged microelectromechanical systems devices because of the difficulties of hermetical sealing and electrical insulation. This paper presents an approach of Au film selective patterning on highly uneven surfaces for wire interconnection...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2018-09-01
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| Series: | Nanotechnology and Precision Engineering |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589554018300035 |