Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys

Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys

During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of intermetallic compounds (IMC) on radio frequency resistance of soldered joint has been...

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Bibliographic Details
Main Authors:	J. Podzemsky, V. Papez, J. Urbanek, K. Dusek
Format:	Article
Language:	English
Published:	Spolecnost pro radioelektronicke inzenyrstvi 2012-06-01
Series:	Radioengineering
Subjects:	RF resistance intermetallic compounds lead free alloys
Online Access:	http://www.radioeng.cz/fulltexts/2012/12_02_0573_0579.pdf

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