TSV Technology and High-Energy Heavy Ions Radiation Impact Review
Three-dimensional integrated circuits (3D IC) based on TSV (Through Silicon Via) technology is the latest packaging technology with the smallest size and quality. As a result, it can effectively reduce parasitic effects, improve work efficiency, reduce the power consumption of the chip, and so on. T...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-07-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2079-9292/7/7/112 |