Effect of temperature on the electrodeposition of disperse copper deposits

Effect of temperature on the electrodeposition of disperse copper deposits

The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by scanning electron microscopic (SEM) analysis o...

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Bibliographic Details
Main Authors:	Nikolić Nebojša D., Pavlović Ljubica J., Pavlović Miomir G., Popov Konstantin I.
Format:	Article
Language:	English
Published:	Serbian Chemical Society 2007-01-01
Series:	Journal of the Serbian Chemical Society
Subjects:	electrodeposition copper hydrogen evolution temperature viscosity surface tension
Online Access:	http://www.doiserbia.nb.rs/img/doi/0352-5139/2007/0352-51390712369N.pdf

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