CONTAMINATIONS IN MEMS PROCESSES AND REMOVAL METHODOLOGY
Wafer impurities and process particulates are one of the prime reason of MEMS device failure. Various cleaning methodologies are evolved but cleaning remains a critical process in MEMS domain as varied materials along with micromachining operations are involved. Bulk and surface micromachining p...
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| Format: | Article |
| Language: | English |
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ICT Academy of Tamil Nadu
2017-04-01
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| Series: | ICTACT Journal on Microelectronics |
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| Online Access: | http://ictactjournals.in/paper/IJME_Vol_3_Iss_1_Paper_8_375_378.pdf |