Agglomeration of Silicon Dioxide Nanoscale Colloids in Chemical Mechanical Polishing Wastewater: Influence of pH and Coagulant Concentration
Chemical mechanical polishing (CMP) wastewater generated from semiconductor manufacturing industries is known to contain residual organic and inorganic contaminants, i.e. photoresists, acids, including silicon dioxide (SiO2), nanoparticles (NPs) and others. Nanoscale colloids in CMP wastewater have...
Main Authors: | Noor Aina Mohamad Zuki, Sin Jing Yao, Jada Amane, Dashti Arezoo Fereidonian, Fatehah Mohd Omar |
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Format: | Article |
Language: | English |
Published: |
Sciendo
2019-09-01
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Series: | Civil and Environmental Engineering Reports |
Subjects: | |
Online Access: | https://doi.org/10.2478/ceer-2019-0040 |
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