Mathematical model of an integrated circuit cooling through cylindrical rods
One of the main challenges in integrated circuits development is to propose alternatives to handle the extreme heat generated by high frequency of electrons moving in a reduced space that cause overheating and reduce the lifespan of the device. The use of cooling fins offers an alternative to enhanc...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2017-01-01
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| Series: | ITM Web of Conferences |
| Online Access: | http://dx.doi.org/10.1051/itmconf/20170901013 |