Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation

Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation

This study uses the finite element analysis (FEA)-based atomistic-continuum method (ACM) combined with the Morse potential of metals to determine the effects of the elastic modulus (<i>E</i>) of a given example on atomic-level single-crystal copper (Cu). This work aims to overcome the es...

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Bibliographic Details
Main Authors: Chang-Chun Lee, Jing-Yan He
Format: Article
Language:English
Published: MDPI AG 2020-11-01
Series:Molecules
Subjects:
atomistic-continuum method
morse potential
atomic bond
finite element analysis
elastic modulus
Online Access:https://www.mdpi.com/1420-3049/25/21/5107

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